PECVD
Aviza offers two platforms for Plasma Enhanced Chemical Vapor Deposition (PECVD), a process chamber common to both platforms and a suite of process recipes targeting compound semiconductor, MEMS and advanced packaging applications.
Platforms
Delta i2L
* A low cost, production-proven platform supporting wafers sizes up to 200mm and accommodating up to 2 process chambers. Twin vacuum cassettes serve as the front-end interface and there are options for integrated wafer cool and align.
Delta fxP
* Proven in high-volume production at wafer sizes up to 300mm, the fxP offers the ultimate in productivity and accepts up to 6 process chambers.
Process Chamber
Advanced Process Module (APM)
The Delta APM serves both i2L and fxP platforms, offering a seamless transition from low cost to high productivity platforms. The many advanced features of the APM include:
- One chamber for all wafer sizes
- Up to 10 gas lines
- Dual frequency RF
- Liquid delivery system
- Variable electrode gap
- Automated chamber clean end-point detection
- Ceramic chamber liners for easy maintenance
Applications
- Compound/Opto Semiconductor
- MIMCAP SiN
- Device passivation
- Final passivation
- MEMS
- High deposition rate SiO/SiN
- Tuned stress
- 'Zero' stress SiN
- Moisture barrier SiN
- Advanced Packaging
- Insulating liner for TSV
- Hard mask
- Cu diffusion barrier SiN